SJ-QFP-01
-IEC 62137-1-1:2007 Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-1: Pull strength test (Corresponding part only) (Japanese Standards: JIS C 62137-1-1: 2010) (Corresponding part only)
-JIS Z 3198-6: 2003 Test methods for lead-free solders Part 6: Methods for 45°pull test of solder joints on QFP lead (Corresponding part only)

SJ-TIP-01
-JIS C 60068-2-21: 2009 Environmental testing-Part 2-21: Tests-Test U: Robustness of terminations and integral mounting devices (Corresponding part only)

SJ-TIP-02
-JIS Z 3198-7: 2003 Test method for lead-free solders-Part 7: Method for shear strength of solder joints on chip components (Corresponding part only)

SJ-TIP03/04
-IEC 62137-1-2:2007 Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-2: Shear strength test (Corresponding part only) (Japanese Standards: JIS C 62137-1-2: 2010) (Corresponding part only)